Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/25/2008
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Application #:
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11878377
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Filing Dt:
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07/24/2007
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Publication #:
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Pub Dt:
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12/13/2007
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Inventors:
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Taimei Kodaira, Sumio Utsunomiya
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Title:
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THIN FILM DEVICE SUPPLY BODY, METHOD OF FABRICATING THIN FILM DEVICE, METHOD OF TRANSFER, METHOD OF FABRICATING SEMICONDUCTOR DEVICE, AND ELECTRONIC EQUIPMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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95 SAMSUNG2RO (SAN #24 NONGSEO-DONG) |
GIHEUNG-GU, GYEONGGI-DO |
YONGIN-CITY, KOREA, REPUBLIC OF 446-711 |
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PATENT DEPARTMENT |
BAKER & MCKENZIE LLP |
2001 ROSS AVENUE, SUITE 2300 |
DALLAS, TX 75201 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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(MAETAN-DONG) 129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, |
SEOUL, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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09/22/2024 02:47 PM
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