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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/18/2011
Application #:
11773830
Filing Dt:
07/05/2007
Publication #:
Pub Dt:
12/20/2007
Inventors:
Siew S. Hiew, Jim C. Ni, Charles C. Lee, I-Kang Yu, Ming-Shiang Shen
Title:
MOLDING METHODS TO MANUFACTURE SINGLE-CHIP CHIP-ON-BOARD USB DEVICE
Assignment: 1
Reel/Frame:
032540/0565Recorded: 03/27/2014Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/24/2005
Assignee:
2079 N. CAPITOL AVE.
SAN JOSE, CALIFORNIA 95132
Correspondent:
STUART T AUVINEN
429 26TH AVE.
SANTA CRUZ, CA 95062
Assignment: 2
Reel/Frame:
019779/0640Recorded: 09/04/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/27/2007
Exec Dt:
07/27/2007
Exec Dt:
07/27/2007
Exec Dt:
07/27/2007
Exec Dt:
08/23/2007
Assignee:
2079 NORTH CAPITOL AVENUE
SAN JOSE, CALIFORNIA 95132
Correspondent:
BEVER, HOFFMAN & HARMS, LLP
2099 GATEWAY PLACE, SUITE 320
SAN JOSE, CA 95110

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