Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11768919
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Filing Dt:
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06/27/2007
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Publication #:
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Pub Dt:
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12/27/2007
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Inventors:
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Kye Nam Lee, Young Jin Park, Yoo Ran Kim, Hyun Kyu Yang
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Title:
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Semiconductor package has bump electrodes connected to metal pads, and passivation film provided on semiconductor chip surface other than upper surfaces of bump electrodes.
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 133-704, SIBEOMDANJI SAMSUNG APT., SEOHYEON-DONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO |
| SEONGNAM-SI, KOREA, REPUBLIC OF 463-050 |
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| DEXTER CHIN |
| 8 KALLANG SECTOR |
| EAST WING 7TH FLOOR |
| SINGAPORE, 349282 SINGAPORE |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 53-3 EOEUN-DONG, YUSEONG-GU, DAEJEON, 305-806 |
| NNFC (NATIONAL NANO FAB CENTER) |
| DAEJEON, KOREA, REPUBLIC OF 305-806 |
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| DEXTER CHIN |
| 8 KALLANG SECTOR |
| EAST WING 7TH FLOOR |
| SINGAPORE, 349282 SINGAPORE |
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