Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11475532
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Filing Dt:
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06/27/2006
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Publication #:
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Pub Dt:
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12/27/2007
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Inventors:
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Daniel Justin Hebel, Clifford Allen Gaw, Brinda Kumar Ramaiya, James Stephen Rutledge
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Title:
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INTEGRATED CIRCUIT CHIP THERMAL SOLUTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| LENOVO (US)IP LAW |
| MAIL STOP ZHHAV B675 |
| P.O. BOX 12195. 3039 CORNWALLIS ROAD |
| RESEARCH TRIANGLE PARK, NC 27709-2195 |
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Assignment:
2
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 23/F, LINCOLN HOUSE, 979 KING'S ROAD |
| QUARRY BAY, HONG KONG |
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| BECKY WILLIAMS |
| 222 W. MERCHANDISE MART PLAZA |
| SUITE 1800 |
| CHICAGO, IL 60654 |
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