Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11748120
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Filing Dt:
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05/14/2007
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Publication #:
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Pub Dt:
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01/03/2008
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Inventors:
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Ming-Fang Tsai, Chi-Chun Huang
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Title:
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HEAT SINK BACK PLATE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F., NO. 37, SEC. 2, JHONGYANG S. RD. |
| PEITOU DISTRICT, TAIPEI 112, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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