Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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11428158
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Filing Dt:
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06/30/2006
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Publication #:
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Pub Dt:
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01/03/2008
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Inventors:
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David B. Slater JR., John A. Edmond, Hua-Shuang Kong
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Title:
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NICKEL TIN BONDING SYSTEM FOR SEMICONDUCTOR WAFERS AND DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4600 SILICON DRIVE |
DURHAM, NORTH CAROLINA 27703 |
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SUMMA, ALLAN AND ADDITON, P.A. |
11610 N. COMMUNITY HOUSE ROAD |
SUITE 200 |
CHARLOTTE, NC 28277 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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39870 EUREKA DRIVE |
NEWARK, CALIFORNIA 94560 |
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SAGE PATENT GROUP |
PO BOX 30789 |
RALEIGH, NC 27622-0789 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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28 STATE STREET |
BOSTON, MASSACHUSETTS 02109 |
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KING & SPALDING LLP |
300 S. TRYON ST., STE 1700 |
ATTN: MOIRA SHEEHAN |
CHARLOTTE, NC 28202 |
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