Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11490092
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Filing Dt:
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07/21/2006
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Publication #:
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Pub Dt:
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01/24/2008
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Inventors:
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Syh-Tau Yeh, Yao-Ming Chen
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Title:
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Method for fabricating multi-layered printed circuit board without via holes
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 14, LANE 276, YUNG FENG RD. |
PATEH CITY |
TAOYUAN HSIEN, TAIWAN |
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JOE MCKINNEY MUNCY |
BIRCH, STEWART, KOLASCH & BIRCH, LLP |
8110 GATEHOUSE ROAD, SUITE 100 EAST |
P.O. BOX 747 |
FALLS CHURCH, VA 22040-0747 |
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