Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11826302
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Filing Dt:
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07/13/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Inventor:
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Hung Tsun Lin
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Title:
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Chip-stacked package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, R&D RD. 1, SCIENCE-BASED |
INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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CANON'S COURT, 22 VICTORIA STREET |
HAMILTON HM 12, BERMUDA |
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STANLEY P. FISHER |
REED SMITH LLP |
3110 FAIRVIEW PARK DR., SUITE 1400 |
FALLS CHURCH, VIRGINIA 22042 |
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