Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/2010
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Application #:
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11757795
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Filing Dt:
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06/04/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Inventors:
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Jun Young YANG, You Ock JOO, Dong Pil JUNG
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Title:
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CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD RD. |
| NANTZE EXPORT PROCESSING ZONE |
| TAIWAN, CHINA 812 |
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| PILLSBURY WINTHROP SHAW PITTMAN LLP |
| 1650 TYSONS BOULEVARD |
| P.O. BOX 10500 |
| MCLEAN, VA 22012 |
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