Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11646304
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Filing Dt:
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12/28/2006
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Publication #:
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Pub Dt:
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02/14/2008
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Inventors:
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Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai et al
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Title:
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Wire-bonding apparatus and wire-bonding method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, JINGSAN RD., NANTZ CHIU |
| KAOHSIUNG, TAIWAN 811 |
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| JOE MCKINNCY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8100 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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