Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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11829406
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Filing Dt:
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07/27/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Inventor:
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Sankar K. Paul
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Title:
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CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7366 NORTH LINCOLN AVENUE, SUITE 410 |
LINCOLNWOOD, ILLINOIS 60712 |
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CANTOR COLBURN LLP |
55 GRIFFIN ROAD SOUTH |
LEAH M. REIMER |
BLOOMFIELD, CT 06002 |
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Assignment:
2
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10 SOUTH DEARBORN |
CHICAGO, ILLINOIS 60603 |
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DUSAN CLARK, ESQ. |
SIDLEY AUSTIN LLP |
717 N. HARWOOD ST., SUITE 3400 |
DALLAS, TX 75201 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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IL1-1145/54/63, P.O. BOX 6026 |
CHICAGO, ILLINOIS 60680-6026 |
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GAYLE D. GROCKE C/O L&W |
330 N. WABASH AVENUE |
SUITE 2800 |
CHICAGO, IL 60611 |
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Assignment:
4
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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IL1-1145/54/63, P.O. BOX 6026 |
CHICAGO, ILLINOIS 60680-6026 |
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ZEYNEP GIESEKE |
330 N. WABASH AVENUE, SUITE 2800 |
LATHAM & WATKINS LLP |
CHICAGO, IL 60611 |
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