Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11837734
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Filing Dt:
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08/13/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Inventors:
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Kuniaki MAEJIMA, Shinsuke MIYABE, Masahiro IZUMI, Hiroaki TANAKA, Makiko KURODA
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Title:
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POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, PRODUCTION METHOD THEREOF, AND POLISHING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, KAMEIDO 9-CHOME. KOTO-KU |
| TOKYO, JAPAN |
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| 2647 HAYAKAWA, AYASE-SHI |
| KANAGAWA, JAPAN |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE-700 |
| WASHINGTON, DC 20036-2657 |
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