Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11889498
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Filing Dt:
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08/14/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Inventors:
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Doo-Hwan Lee, Seung-Gu Kim, Won-Cheol Bae, Moon-Il Kim
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Title:
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Component-embedded multilayer printed wiring board and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN3-DONG, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO 443-743, KOREA, REPUBLIC OF |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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