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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11543053
Filing Dt:
10/05/2006
Publication #:
Pub Dt:
02/21/2008
Inventor:
Hung-Tsun Lin
Title:
BGA package with leads on chip field of the invention
Assignment: 1
Reel/Frame:
018390/0342Recorded: 10/05/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/12/2006
Assignees:
CANON'S COURT, 22 VICTORIA STREET
HAMILTON HM 12, BERMUDA
NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
TROXELL LAW OFFICE PLLC
5205 LEESBURG PIKE
SUITE 1404
FALLS CHURCH, VIRGINIA 22041-3401

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