Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11466539
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Filing Dt:
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08/23/2006
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Publication #:
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Pub Dt:
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03/06/2008
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Inventors:
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Guan Keng Quah, Hou Boon Tan, Qiang Hua Pan
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 EAST MCDOWELL ROAD |
| A700 |
| PHOENIX, ARIZONA 85008 |
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| LYDIA MCNAMARA |
| 5005 E MCDOWELL RD |
| A700 |
| PHOENIX, AZ 85008 |
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Assignment:
2
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10017 |
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| IP RESEARCH PLUS, INC. |
| 21 TADCASTER CIRCLE |
| ATTN: PENELOPE J.A. AGODOA |
| WALDORF, MD 20602 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL RD. |
| MD A700 |
| PHOENIX, ARIZONA 85008 |
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| 27A WEST PEOPLE'S RD. |
| LESHAN, SICHUAN, CHINA |
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| ON SEMICONDUCTOR |
| 5005 E. MCDOWELL RD |
| MD A700 - PATENT ADMINISTRATION |
| PHOENIX, AZ 85008 |
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Assignment:
4
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RELEASE OF SECURITY INTEREST
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| 5005 EAST MCDOWELL ROAD |
| MD-A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD-A700 |
| PHOENIX, AZ 85008 |
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