Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11470511
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Filing Dt:
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09/06/2006
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Publication #:
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Pub Dt:
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03/06/2008
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Inventors:
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Michael Bauer, Christian Stuempfl, Ludwig Heitzer
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Title:
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MULTI-CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ST.-MARTIN-STR. 53 |
MUNICH, GERMANY 81669 |
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GERO G. MCCLELLAN |
3040 POST OAK BLVD., SUITE 1500 |
HOUSTON, TX 77056 |
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05/29/2024 08:33 AM
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