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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11852179
Filing Dt:
09/07/2007
Publication #:
Pub Dt:
03/13/2008
Inventors:
Ky-Hyun JUNG, Wha-Su SIN, Heui-Seog KIM, Sang-Jun KIM, Jun-Young KO
Title:
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
019799/0825Recorded: 09/07/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/27/2007
Exec Dt:
08/27/2007
Exec Dt:
08/28/2007
Exec Dt:
08/27/2007
Exec Dt:
08/27/2007
Assignee:
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MARGER JOHNSON & MCCOLLOM, P.C.
210 SW MORRISON STREET, SUITE 400
PORTLAND, OR 97204

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