Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11898143
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Filing Dt:
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09/10/2007
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Publication #:
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Pub Dt:
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03/13/2008
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Inventors:
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Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chul Jeong, Chang Bum Chung
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Title:
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Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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290, GONGDAN 2-DONG, GUMI-SI |
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF |
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EUGENE M. LEE |
LEE & MORSE, PC |
3141 FAIRVIEW PARK DRIVE, SUITE 500 |
FALLS CHURCH, VA 22042 |
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Assignment:
2
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RE-RECORD TO CORRECT SPELLING OF 5TH INVENTOR'S NAME AND CORRECT SPELLING OF ASSIGNEE' NAME IN REEL/FRAME: 020182/0692-3
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290, GONGDAN 2-DONG, GUMI-SI |
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF |
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EUGENE M. LEE |
LEE & MORSE, P.C. |
3141 FAIRVIEW PARK DRIVE, SUTIE 500 |
FALLS CHURCH, VA 22042 |
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