Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11522759
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Filing Dt:
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09/18/2006
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Publication #:
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Pub Dt:
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03/20/2008
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Inventor:
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Nicole A. Buttel
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Title:
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Thermal interface layer utilizing both thermal film and spherical spacers to control thickness in a semiconductor die package.
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4380 ZIEGLER ROAD |
M/S 76 |
FORT COLLINS, COLORADO 80525 |
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AVAGO TECHNOLOGIES, LTD. |
C/O KLAAS, LAW, O'MEARA & MALKIN, P.C. |
P.O. BOX 1920 |
DENVER, CO 80201-1920 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND ADDRESS ON A DOCUMENT PREVIOUSLY RECORDED ON REEL 018322 FRAME 0356. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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AVAGO TECHNOLOGIES, LTD. |
P.O. BOX 1920 |
DENVER, CO 80201-1920 |
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