Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/23/2011
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Application #:
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11699710
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Filing Dt:
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01/30/2007
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Publication #:
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Pub Dt:
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03/27/2008
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Inventors:
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David Shau Chew Wang, En Tien Yang, Jyh Ming Yu, Fu Hua Chu
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Title:
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HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2F, NO. 2, PROSPERITY RD. II, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300, R.O.C. |
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HAROLD V. STOTLAND |
SEYFARTH SHAW LLP |
131 S. DEARBORN ST. |
SUITE 2400 |
CHICAGO, ILLINOIS 60603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1 F., NO. 81, GONGYE RD., LUZHU VIL., TOUFEN CITY |
MIAOLI COUNTY, TAIWAN |
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WINSTON HSU |
5F., NO.389, FUHE RD., YONGHE DIST., |
NEW TAIPEI CITY, TAIWAN |
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