Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/21/2012
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Application #:
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11903190
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Filing Dt:
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09/20/2007
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Publication #:
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Pub Dt:
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03/27/2008
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Inventors:
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Chris Apanius, Hendra Ng, Robert A. Shick, Andrew Bell, Wei Zhang, Phil Neal
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Title:
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METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9921 BRECKSVILLE ROAD, BUILDING R |
BRECKSVILLE, OHIO 44141 |
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THE WEBB LAW FIRM PC |
436 SEVENTH AVENUE, 700 KOPPERS BUILDING |
PITTSBURGH, PA 15219 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-8 HIGASHI-SHINAGAWA, 2-CHOME SHINAGAWA-KU |
TOKYO, JAPAN 140-0002 |
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PROMERUS LLC |
9921 BRECKSVILLE ROAD |
BRECKSVILLE, OH 44141 |
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