Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/15/2011
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Application #:
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11527298
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Filing Dt:
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09/26/2006
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Publication #:
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Pub Dt:
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03/27/2008
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Inventors:
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Cheng Qiang Cui, Chee Wah Cheung
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Title:
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MULTIPLE INTEGRATED CIRCUIT DIE PACKAGE WITH THERMAL PERFORMANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SUITE 10, 5TH FLOOR, CHIAPHUA CENTRE |
12 SIU LEK YUEN |
SHATIN, HONG KONG |
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SAILE ACKERMAN LLC |
28 DAVIS AVENUE |
POUGHKEEPSIE, NY 12603 |
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