Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11902486
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Filing Dt:
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09/21/2007
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Publication #:
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Pub Dt:
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04/03/2008
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Inventors:
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Hyun-Chul Jung, Jae-Woo Joung, Hye-Jin Cho, Yoon-Ah Baik, Sung-Il Oh
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Title:
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Method for manufacturing cover lay of printed circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN3-DONG |
| YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVENUE, N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE FIFTH ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 019942, FRAME 0946. ASSIGNORS HEREBY CONFIRM THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| 314, MAETAN3-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO 443-742, KOREA, REPUBLIC OF |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVE., N.W., 7TH FLOOR |
| WASHINGTON, DC 20005 |
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