Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/2010
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Application #:
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11541112
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Filing Dt:
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09/29/2006
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Publication #:
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Pub Dt:
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04/03/2008
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Inventors:
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Nachiket R. Raravikar, Daewoong Suh, Leonel Arana, James C. Matayabas JR.
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Title:
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THROUGH-DIE METAL VIAS WITH A DISPERSED PHASE OF GRAPHITIC STRUCTURES OF CARBON FOR REDUCED THERMAL EXPANSION AND INCREASED ELECTRICAL CONDUCTANCE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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INTEL CORPORATION, C/O CPA GLOBAL |
PO BOX 52050 |
MINNEAPOLIS, MN 55402 |
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