Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11866780
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Filing Dt:
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10/03/2007
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Publication #:
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Pub Dt:
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04/10/2008
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Inventor:
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Shoichi OSADA
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Title:
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EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND THIN SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 41-1, AZA YOKOMICHI, OAZA NAGAKUTE, NAGAKUTE-CHO, AICHI-GUN |
| AICHI-GUN, JAPAN 480-1192 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS AND ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 019916 FRAME 0428. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 6-1, OTEMACHI 2-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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