Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/13/2009
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Application #:
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11943655
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Filing Dt:
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11/21/2007
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Publication #:
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Pub Dt:
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04/24/2008
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Inventors:
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Yao-Ting Huang, Chih-Huang Chang
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Title:
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LEADFRAME OF A LEADLESS FLIP-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, JINGSAN RD. |
NANTZ CHIU |
KAOHSIUNG, TAIWAN 811, R.O.C. |
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DANIEL R. MCCLURE |
600 GALLERIA PARKWAY |
15TH FLOOR |
ATLANTA, GA 30339 |
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