Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/16/2009
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Application #:
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11825713
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Filing Dt:
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07/09/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Inventor:
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Byung-kil Kwak
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF FORMING WIRE LOOP OF SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 SUNGJU-DONG |
| CHANGWONG-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF |
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| DAVID R. MORRIS |
| DRINKER BIDDLE & REALTH LLP |
| 191 N. WACKER DRIVE, SUITE 3700 |
| CHICAGO, IL 60606-1698 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1204,CHANGWON-DAERO |
| SEONGSAN-GU |
| CHANGWON-SI, GYEONGSANGNAM-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BRYANT E. WADE |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 036714 FRAME: 0757. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME.
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| 1204, CHANGWON-DAERO |
| SEONGSAN-GU |
| CHANGWON-SI, GYEONGSANGNAM-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BRYANT E. WADE |
| BLOOMFIELD HILLS, MI 48303 |
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