Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/11/2009
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Application #:
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11588802
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Filing Dt:
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10/27/2006
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Publication #:
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Pub Dt:
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05/01/2008
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Inventors:
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Cheng Qiang Cui, Kai C. Ng, Chee Wah Cheung
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Title:
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DIE-UP INTEGRATED CIRCUIT PACKAGE WITH GROUNDED STIFFENER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12 SUI LEK YUEN |
| SUITE 10, 5TH FLOOR, CHIAPHUA CENTRE |
| SHATIN, HONG KONG |
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| SAILE ACKERMAN LLC |
| 28 DAVIS AVENUE |
| POUGHKEEPSIE, NY 12603 |
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