Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11847813
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Filing Dt:
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08/30/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Inventors:
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Neil McLellan, Vincent K. Chan, Roden Topacio
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Title:
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Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 COMMERCE VALLEY DRIVE EAST |
| MARKHAM, ONTARIO, CANADA L3T 7N6 |
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| ALAIN VILLENEUVE |
| VEDDER PRICE P.C. |
| 222 N. LASALLE ST., SUITE 2600 |
| CHICAGO, IL 60601 |
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