Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11898349
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Filing Dt:
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09/11/2007
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Publication #:
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Pub Dt:
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05/08/2008
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Inventor:
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Hiroshi Minazawa
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Title:
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Molding die, intermediate member, and method of manufacturing of substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-2 OSAKI 1-CHOME, SHINAGAWA-KU |
| 141-0032 TOKYO, JAPAN |
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| STEVEN M. RABIN |
| RABIN & BERDO, PC |
| 1101 14TH ST., NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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