Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11933067
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Filing Dt:
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10/31/2007
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Publication #:
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Pub Dt:
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05/08/2008
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Inventor:
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Min-Ho LEE
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Title:
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SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| 210 SW MORRISON STREET, SUITE 400 |
| PORTLAND, OR 97204 |
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