Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2008
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Application #:
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11463273
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Filing Dt:
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08/08/2006
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Publication #:
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Pub Dt:
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05/29/2008
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Inventor:
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Ching-Wen TUNG
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Title:
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FLIP-CHIP PACKAGING STRUCTURE FOR LIGHT EMITTING DIODE AND METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 40, INDUSTRIAL 34 ROAD |
| TAICHUNG INDUSTRIAL PARK |
| TAICHUNG, TAIWAN |
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| ANTHONY KING |
| 92 CORPORATE PARK, STE. C757 |
| IRVINE, CA 92606 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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