Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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11980760
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Filing Dt:
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10/31/2007
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Publication #:
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Pub Dt:
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06/05/2008
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Inventors:
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Takahiro Kotani, Yoshinori Nishitani, Daisuke Oka
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Title:
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EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOYKO, JAPAN 140-0002 |
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| MICHAEL A. MAKUCH |
| SMITH, GAMBRELL & RUSSELL, LLP |
| 1130 CONNECTICUT AVENUE, SUITE 1130 |
| WASHINGTON, D.C. 20036 |
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