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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11609706
Filing Dt:
12/12/2006
Publication #:
20080135991
Pub Dt:
06/12/2008
Inventors:
James Harnden, Richard K. Williams, Anthony Chia, Teng Hui, Hongbo Yang, Zhou Ming et al
Title:
SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS
Assignment: 1
Reel/Frame:
019139/0788Recorded: 04/02/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HARNDEN, JAMES
Exec Dt:
02/21/2007
WILLIAMS, RICHARD K.
Exec Dt:
02/21/2007
CHIA, ANTHONY
Exec Dt:
03/02/2007
HUI, TENG
Exec Dt:
03/02/2007
YANG, HONGBO
Exec Dt:
03/02/2007
MING, ZHOU
Exec Dt:
03/02/2007
TSUI, ANTHONY C.
Exec Dt:
02/21/2007
Assignee:
GEM SERVICES, INC.
2880 LAKESIDE DRIVE, SUITE 203
SANTA CLARA, CALIFORNIA 95054
Correspondent:
KENT J. TOBIN
TOWNSEND AND TOWNSEND AND CREW LLP
TWO EMBARCADERO CENTER, EIGHTH FLOOR
SAN FRANCISCO, CALIFORNIA 94111-3834

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