Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12001612
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Filing Dt:
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12/11/2007
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Publication #:
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Pub Dt:
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06/19/2008
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Inventors:
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Chin-Te Chen, Ke-Chuan Yang, Chang-Fu Lin
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Title:
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HEAT-DISSIPATING STRUCTURE AND HEAT-DISSIPATING SEMICONDUCTOR PACKAGE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.123, SEC 3, DA FONG RD, TANTZU |
| TAICHUNG, TAIWAN ROC |
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| PETER F. CORLESS |
| EDWARDS ANGELL PALMER & DODGE, LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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