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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/07/2010
Application #:
12000125
Filing Dt:
12/10/2007
Publication #:
Pub Dt:
07/03/2008
Inventors:
In Hyung Lee, Yul Kyo Chung, Bae Kyun Kim, Seung Eun Lee, Jung Won Lee
Title:
METHOD OF MANUFACTURING CIRCUIT BOARD EMBEDDING THIN FILM CAPACITOR
Assignment: 1
Reel/Frame:
020259/0633Recorded: 12/10/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/22/2007
Exec Dt:
10/22/2007
Exec Dt:
10/22/2007
Exec Dt:
10/22/2007
Exec Dt:
10/22/2007
Assignee:
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON
GYUNGGI-DO, REPUBLIC OF, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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