Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007786
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Filing Dt:
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01/15/2008
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Publication #:
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Pub Dt:
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07/17/2008
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Inventors:
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Akira Kodera, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Itsuki Kobata
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Title:
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Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
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| WENDEROTH LIND & PONACK, LLP |
| ATTN: DAVID M. OVEDOVITZ, ESQ. |
| 2033 K STREET, NW |
| SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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