Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11701024
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Filing Dt:
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01/31/2007
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Publication #:
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Pub Dt:
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07/31/2008
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Inventors:
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Jen-Lu Hu, Hao-Hui Lin, Tsung-Ching Lin, Su-Chen Hu
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Title:
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Heat dissipating device for heat dissipation of an electronic component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 59, CHIN HUA RD., 4TH SEC. |
| TAINAN CITY, TAIWAN |
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| TIMOTHY W. LOHSE |
| DLA PIPER US LLP |
| 2000 UNIVERSITY AVENUE |
| EAST PALO ALTO, CA 94303 |
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