Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11755293
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Filing Dt:
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05/30/2007
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Publication #:
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Pub Dt:
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08/14/2008
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Inventors:
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Wen-Kun Yang, Jui-Hsien Chang, Hsien-Wen Hsu, Diann-Fang Lin
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Title:
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CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 65, GUANGFU N. RD. |
HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 303 |
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MICHAEL A. JAFFE |
6151 WILSON MILLS ROAD |
HIGHLAND PLACE - SUITE 310 |
HIGHLAND HEIGHTS, OH 44040 |
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