Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11706248
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Filing Dt:
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02/15/2007
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Publication #:
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Pub Dt:
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08/21/2008
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Inventors:
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Hyeongno Kim, Soo-Min Choi, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha
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Title:
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Package structure and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, JINGSAN RD., NANTZ CHIU |
KAOHSIUNG, TAIWAN ROC 811 |
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JOE MCKINNEY MUNCY |
BIRCH, STEWART, KOLASCH & BIRCH, LLP |
8110 GATEHOUSE ROAD, SUITE 100 EAST |
P.O. BOX 747 |
FALLS CHURCH, VIRGINIA 22040-074 |
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