Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/05/2010
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Application #:
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12070000
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Filing Dt:
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02/14/2008
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Publication #:
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Pub Dt:
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08/21/2008
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Inventors:
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Tatsunari Mii, Toshihiko Toyama, Hiroaki Yoshino
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Title:
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SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 150 NORTH 600 EAST |
| AMERICAN FORK, UTAH 84003 |
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| F. CHAD COPIER |
| P.O. BOX 1319 |
| SALT LAKE CITY, UT 84110 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-51-1, INADAIRA |
| MUSASHIMURAYAMA-SHI, TOKYO, JAPAN |
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| WILLIAM L. ANDROLIA |
| QUINN EMANUEL URQUHART, ET AL. |
| 865 S. FIGUEROA STREET |
| 10TH FLOOR |
| LOS ANGELES, CA 90017 |
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