Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11573295
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Filing Dt:
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02/06/2007
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Publication #:
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Pub Dt:
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08/28/2008
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Inventor:
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Xiangyang Yin
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Title:
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Method of Improving the Strength of a Spot-Welded Joint Between Fine Enameled Wire and Circuit Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8/F, BLDG. 8, HUANGZHOU INDUSTRY PARK, CHEBEI RD., TIANHE DISTRICT, |
GUANGZHOU, CHINA 510660 |
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WANG & HO |
66 HILLTOP ROAD |
MILLINGTON, NJ 07946 |
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09/22/2024 03:42 AM
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