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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/31/2011
Application #:
12023761
Filing Dt:
01/31/2008
Publication #:
Pub Dt:
08/28/2008
Inventors:
Gi-Jo Jung, In Soo Kang, Jong Heon Kim, Seung Dae Baek
Title:
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
Assignment: 1
Reel/Frame:
020450/0891Recorded: 01/31/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/15/2008
Exec Dt:
01/15/2008
Exec Dt:
01/08/2008
Exec Dt:
01/08/2008
Assignees:
654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN
CHUNGBUK, KOREA, REPUBLIC OF 363-883
12 ANG MO KIO STREET 65
SINGAPORE, SINGAPORE
Correspondent:
MARGER JOHNSON & MCCOLLOM, P.C.
210 SW MORRISON STREET, SUITE 400
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
038755/0553Recorded: 05/31/2016Pages: 4
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/31/2014
Assignee:
12 ANG MO KIO STREET 65, LEK SUN BUILDING
SINGAPORE, SINGAPORE 569060
Correspondent:
RENAISSANCE IP LAW GROUP LLP (PIP)
9600 SW OAK ST. SUITE 560
PORTLAND, OR 97223

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