Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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12072156
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Filing Dt:
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02/25/2008
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Publication #:
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Pub Dt:
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08/28/2008
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Inventors:
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Detlef Schupp, Thin Van Luu
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Title:
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METHOD FOR ACQUIRING HIGH-RESOLUTION IMAGES OF DEFECTS ON THE UPPER SURFACE OF THE WAFER EDGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KUBACHER WEG 4 |
| WEILBURG, GERMANY 35781 |
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| WILLIAM C. GEHRIS |
| DAVIDSON DAVIDSON & KAPPEL, LLC |
| 485 SEVENTH AVENUE |
| 14TH FLOOR |
| NEW YORK, NY 10018 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KUBACHER WEG 4 |
| WEILBURG, GERMANY 35781 |
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| WILLIAM C. GEHRIS |
| DAVIDSON, DAVIDSON & KAPPEL, LLC |
| 485 SEVENTH AVENUE |
| 14TH FLOOR |
| NEW YORK, NY 10018 |
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