Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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12053478
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Filing Dt:
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03/21/2008
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Publication #:
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Pub Dt:
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09/25/2008
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Inventors:
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In-Young Lee, Ho-Jin Lee, Hyun-Soo Chung, Ju-Il Choi, Son-Kwan Hwang
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Title:
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WAFER-LEVEL STACK PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| 210 SW MORRISON STREET, SUITE 400 |
| PORTLAND, OR 97204 |
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