Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/06/2009
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Application #:
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11761374
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Filing Dt:
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06/12/2007
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Publication #:
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Pub Dt:
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09/25/2008
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Inventors:
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Hsien-Kun Chiu, Chin-Chuan Lai, Yi-Pen Lin, Shu-Chen Yang
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Title:
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METHOD FOR FABRICATING CONDUCTIVE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 22, SEC. 3, CHUNGSHAN N RD. |
TAIPEI, TAIWAN |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
TAIPEI, TAIWAN |
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