Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12054562
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Filing Dt:
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03/25/2008
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Publication #:
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Pub Dt:
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10/02/2008
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Inventors:
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Ki-Hyun KIM, Jin Yu, Young-Min Lee, Yong Jung, June-Hyeon Ahn, Ho-Seong Seo, Youn-Ho Choi et al
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| 373-1, GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF |
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| STEVEN CHA |
| CHA & REITER |
| 210 ROUTE 4 EAST, SUITE #103 |
| PARAMUS, NJ 07652 |
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