Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12049728
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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10/02/2008
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Inventors:
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Yuji YANO, Yasuki Fukui, Koji Miyata
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Title:
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SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK, SEMICONDUCTOR CHIP, INTERPOSER SUBSTRATE, AND GLASS PLATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA-SHI, OSAKA, JAPAN 545-8522 |
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| H. WARREN BURNAM |
| NIXON & VANDERHYE, PC |
| 901 NORTH GLEBE ROAD, 11TH FLOOR |
| ARLINGTON, VA 22203 |
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