Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11736461
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Filing Dt:
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04/17/2007
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Publication #:
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Pub Dt:
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10/23/2008
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Inventors:
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Wen-Kun YANG, Diann-Fang LIN
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Title:
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SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 65, GUANGFU NO. RD., HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 303 |
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| LAWRENCE A. MAXHAM |
| THE MAXHAM FIRM |
| 9330 SCRANTON ROAD, SUITE 350 |
| SAN DIEGO, CA 92121 |
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