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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11788986
Filing Dt:
04/23/2007
Publication #:
Pub Dt:
10/23/2008
Inventors:
Ming-Shih Yeh, Tien-I Bao, David Ding-Chung Lu
Title:
Novel structure for reducing low-k dielectric damage and improving copper EM performance
Assignment: 1
Reel/Frame:
019315/0375Recorded: 05/18/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/18/2007
Exec Dt:
04/18/2007
Exec Dt:
04/22/2007
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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